ASTM F3166-16
- Standard Specification for High-Purity Titanium Sputtering Target Used for Through-Silicon Vias (TSV) Metallization
- standard by ASTM International, 05/01/2016
- Publisher: ASTM
$22.00$44.00
1.1 This specification details the generic criteria requirements of high pure titanium sputtering targets used as thin film material for through-silicon vias (TSV) metallization in advance packaging.
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