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COMPUTER AIDED CHIP DEVELOPMENT DATA(SUPERSEDING DI-MCCR-80499)..
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DATA ITEM DESCRIPTIONS (DIDS) (SUPERSEDING DI-MISC-80000A)..
ELECTROMAGNETIC EFFECTS BERIFICATION PROCEDURES (EMEVP)(SUPERSEDING DI-EMCS-81295)..
SPECIAL PACKAGING INSTRUCTIONS (SPI) (SUPERSEDING DI-PACK-80121) (S/S BY DI-PACK-80121B)..