Provide PDF Format
JEDEC JEP140 (R2006)
- BEADED THERMOCOUPLE TEMPERATURE MEASUREMENT OF SEMICONDUCTOR PACKAGES
- standard by JEDEC Solid State Technology Association, 06/01/2002
- Publisher: JEDEC
$27.00$54.00
The beaded thermocouple temperature measurement guideline provides a procedure to accurately and consistently measure the temperature of semiconductor packages during exposure to thermal excursions. The guideline applications can include, but not limited to, temperature profile measurement in reliability test chambers and solder reflow operations that are associated with component assembly to printed wiring boards.
Related Products
JEDEC JS709A
JOINT JEDEC/ECA STANDARD, DEFINING "LOW-HALOGEN" PASSIVES AND SOLID STATE DEVICES (Removal..
$30.00 $59.00
JEDEC JEB 15
TERMINOLOGY AND METHODS OF MEASUREMENT FOR BISTABLE SEMICONDUCTOR MICROCIRCUITS..
$71.00 $141.00