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  • JEDEC JEP156
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JEDEC JEP156

  • CHIP-PACKAGE INTERACTION UNDERSTANDING, IDENTIFICATION AND EVALUATION
  • standard by JEDEC Solid State Technology Association, 03/01/2009
  • Publisher: JEDEC

$34.00$67.00


This publication references a set of frequently recommended and accepted JEDEC reliability stress tests. These tests are used for qualifying new and modified technology/ process/ product families, as well as individual solid state surface-mount products.

Product Details

Published:
03/01/2009
Number of Pages:
24
File Size:
1 file , 150 KB

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