Provide PDF Format
JEDEC JEP158
- 3D Chip Stack with Through-Silicon Vias (TSVS): Identifying, Evaluating and Understanding Reliability Interactions
- standard by JEDEC Solid State Technology Association, 11/01/2009
- Publisher: JEDEC
$31.00$62.00
To increase device bandwidth, reduce power and shrink form factor, microelectronics manufacturers are implementing three dimensional (3D) chip stacking using through silicon vias (TSVs). Chip stacking with TSVs combines silicon and packaging technologies. As a result, these new structures have unique reliability requirements. This document is a guideline that describes how to evaluate the reliability of 3D TSV silicon assemblies.
Related Products
JEDEC JESD 82-26
DEFINITION OF THE SSTUB32868 REGISTERED BUFFER WITH PARITY FOR 2R x 4 DDR2 RDIMM APPLICATIONS..
$37.00 $74.00
