Provide PDF Format
JEDEC JESD 22-A121A (R2014)
- MEASURING WHISKER GROWTH ON TIN AND TIN ALLOY SURFACE FINISHES
- standard by JEDEC Solid State Technology Association, 07/01/2008
- Publisher: JEDEC
$37.00$74.00
The predominant terminal finishes on electronic components have been Sn-Pb alloys. As the industry moves toward Pb-free components and assembly processes, the predominant terminal finish materials will be pure Sn and alloys of Sn, including Sn-Bi and Sn-Ag. Pure Sn and Sn-based alloy electrodeposits and solder-dipped finishes may grow tin whiskers, which could electrically short across component terminals or break off the component and degrade the performance of electrical or mechanical parts.
Related Products
JEDEC JESD 482-A (R2002)
LIST OF PREFERRED VALUES FOR USE ON VARIOUS TYPES OF SMALL SIGNAL AND REGULATOR DIODES..
$24.00 $48.00
JEDEC JESD 82-24
DEFINITION OF the SSTUB32865 28-bit 1:2 REGISTERED BUFFER WITH PARITY FOR DDR2 RDIMM APPLICATIONS..
$36.00 $72.00
