• Your shopping cart is empty!

  • JEDEC JESD 22-B115
Provide PDF Format

Learn More

JEDEC JESD 22-B115

  • SOLDER BALL PULL
  • standard by JEDEC Solid State Technology Association, 05/01/2007
  • Publisher: JEDEC

$31.00$62.00


This document describes a test method only; acceptance criteria and qualification requirements are not defined. This test method applies to solder ball pull force testing prior to end-use attachment. Solder balls are pulled individually using mechanical jaws; force and failure mode data are collected and analyzed. Other specialized solder ball pull methods using a heated thermode, gang pulling of multiple solder joints, etc., are outside the scope of this document. Both low and high speed testing are covered by this document.

Product Details

Published:
05/01/2007
Number of Pages:
22
File Size:
1 file , 130 KB

Related Products

JEDEC JESD20

JEDEC JESD20

STANDARD FOR DESCRIPTION OF 54/74ACXXXXX AND 54/74ACTXXXXX ADVANCED HIGH-SPEED CMOS DEVICES..

$96.00 $191.00

JEDEC JESD220-2

JEDEC JESD220-2

UNIVERSAL FLASH STORAGE (UFS) CARD EXTENSION..

$31.00 $62.00

JEDEC JESD340 (R2009)

JEDEC JESD340 (R2009)

STANDARD FOR THE MEASUREMENT OF CRE..

$27.00 $54.00

JEDEC JESD92

JEDEC JESD92

PROCEDURE FOR CHARACTERIZING TIME-DEPENDENT DIELECTRIC BREAKDOWN OF ULTRA-THIN GATE DIELECTRICS..

$37.00 $74.00