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JEDEC JESD 22-B115
- SOLDER BALL PULL
- standard by JEDEC Solid State Technology Association, 05/01/2007
- Publisher: JEDEC
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This document describes a test method only; acceptance criteria and qualification requirements are not defined. This test method applies to solder ball pull force testing prior to end-use attachment. Solder balls are pulled individually using mechanical jaws; force and failure mode data are collected and analyzed. Other specialized solder ball pull methods using a heated thermode, gang pulling of multiple solder joints, etc., are outside the scope of this document. Both low and high speed testing are covered by this document.
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