Provide PDF Format
JEDEC JESD 9-A
- METAL PACKAGE SPECIFICATION FOR MICROELECTRONIC PACKAGES AND COVERS
- standard by JEDEC Solid State Technology Association, 04/01/1987
- Publisher: JEDEC
$46.00$91.00
This standard establishes the general requirements and quality assurance provisions that can be specified and met in procuring microelectronics packages and covers, manufactured from matched seal with and without high thermal conductivity base materials, intended for use in fabricating hybrid microelectronics circuits. This document details those minimum requirements necessary for metal packages' use exclusively.
Related Products
JEDEC JESD 209A-1
Addendum No. 1 to JESD209A - LOW POWER DOUBLE DATA RATE (LPDDR) SDRAM, 1.2 V I/O..
$27.00 $53.00
JEDEC JESD22-B111
BOARD LEVEL DROP TEST METHOD OF COMPONENTS FOR HANDHELD ELECTRONIC PRODUCTS..
$31.00 $62.00
JEDEC JESD75-5
SON/QFN PACKAGE PINOUTS STANDARDIZED FOR 1-, 2-, AND 3-BIT LOGIC FUNCTIONS..
$27.00 $53.00