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JEDEC JESD11

CHIP CARRIER PINOUTS STANDARDIZED FOR CMOS 4000, HC AND HCT SERIES OF LOGIC CIRCUITS
standard by JEDEC Solid State Technology Association, 12/01/1984
Publisher: JEDEC

$27.00$53.00

This standard indicates the procedures used to convert existing DIP and flat packages for digital parts (SSI & MSI) to chip carrier packages.

Product Details

TEST BOARDS FOR THROUGH-HOLE AREA ARRAY LEADED PACKAGE THERMAL MEASUREMENT..

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DDR3 SDRAM Specification..

$124.00 $247.00

BEADED THERMOCOUPLE TEMPERATURE MEASUREMENT OF SEMICONDUCTOR PACKAGES..

$27.00 $54.00

RELATIVE SPECTRAL RESPONSE CURVES FOR SEMICONDUCTOR INFRARED DETECTORS..

$34.00 $67.00