Provide PDF Format
JEDEC JESD22-A103E
- HIGH TEMPERATURE STORAGE LIFE
- standard by JEDEC Solid State Technology Association, 10/01/2015
- Publisher: JEDEC
$27.00$53.00
The test is applicable for evaluation, screening, monitoring, and/or qualification of all solid state devices. The high temperature storage test is typically used to determine the effects of time and temperature, under storage conditions, for thermally activated failure mechanisms and time-to-failure distributions of solid state electronic devices, including nonvolatile memory devices (data retention failure mechanisms). Thermally activated failure mechanisms are modeled using the Arrhenius Equation for acceleration. During the test, accelerated stress temperatures are used without electrical conditions applied. This test may be destructive, depending on time, temperature and packaging (if any).
Related Products
JEDEC JESD 46C
CUSTOMER NOTIFICATION OF PRODUCT/PROCESS CHANGES BY SEMICONDUCTOR SUPPLIERS..
$27.00 $53.00
JEDEC JESD82-10A
DEFINITION OF THE SSTU32866 1.8 V CONFIGURABLE REGISTERED BUFFER WITH PARITY FOR DDR2 RDIMM APPLICAT..
$40.00 $80.00
JEDEC JESD 82-12A
DEFINITION OF THE SSTU32S869 & SSTU32D869 REGISTERED BUFFER WITH PARITY FOR DDR2 RDIMM APPLICATI..
$37.00 $74.00
JEDEC JEP145
GUIDELINE FOR ASSESSING THE CURRENT-CARRYING CAPABILITY OF THE LEADS IN A POWER PACKAGE SYSTEM..
$27.00 $53.00