• JEDEC JESD22-A104E
Provide PDF Format

Learn More

JEDEC JESD22-A104E

  • TEMPERATURE CYCLING
  • standard by JEDEC Solid State Technology Association, 10/01/2014
  • Publisher: JEDEC

$30.00$59.00


This standard provides a method for determining solid state devices capability to withstand extreme temperature cycling. This standard applies to single-, dual- and triple-chamber temperature cycling and covers component and solder interconnection testing. It should be noted that this standard does not cover or apply to thermal shock chambers. This test is conducted to determine the ability of components and solder interconnects to withstand mechanical stresses induced by alternating high- and low-temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses.

Related Products

JEDEC JESD 82-27

JEDEC JESD 82-27

DEFINITION OF THE SSTUB32869 REGISTERED BUFFER WITH PARITY FOR DDR2 RDIMM APPLICATIONS..

$38.00 $76.00

JEDEC JESD 370B (R2003)

JEDEC JESD 370B (R2003)

DESIGNATION SYSTEM FOR SEMICONDUCTOR DEVICES..

$27.00 $54.00

JEDEC JESD76

JEDEC JESD76

DESCRIPTION OF 1.8 V CMOS LOGIC DEVICES..

$24.00 $48.00

JEDEC JESD223A

JEDEC JESD223A

Universal Flash Storage (UFS) Host Controller Interface..

$46.00 $91.00