• Your shopping cart is empty!

  • JEDEC JESD22-B106D
Provide PDF Format

Learn More

JEDEC JESD22-B106D

  • RESISTANCE TO SOLDER SHOCK FOR THROUGH-HOLE MOUNTED DEVICES
  • standard by JEDEC Solid State Technology Association, 04/01/2008
  • Publisher: JEDEC

$27.00$53.00


This method established a standard procedure for determining whether through-hole solid state devices can withstand the effects of the temperature to which they will be subject during soldering of their leads. This revision updates the references to currently military standards.

Product Details

Published:
04/01/2008
Number of Pages:
12
File Size:
1 file , 70 KB

Related Products

JEDEC JEP69-B (R1999)

JEDEC JEP69-B (R1999)

PREFERRED LEAD CONFIGURATION FOR FIELD-EFFECT TRANSISTORS..

$24.00 $48.00

JEDEC JESD 471 (R2009)

JEDEC JESD 471 (R2009)

SYMBOL AND LABEL FOR ELECTROSTATIC SENSITIVE DEVICES..

$24.00 $48.00

JEDEC JESD230A

JEDEC JESD230A

NAND Flash Interface Interoperability..

$37.00 $74.00

JEDEC JESD73-4

JEDEC JESD73-4

STANDARD FOR DESCRIPTION OF 3877 - 2.5 V, DUAL 5-BIT, 2-PORT, DDR FET SWITCH..

$26.00 $51.00