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  • JEDEC JESD22-B112A
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JEDEC JESD22-B112A

  • PACKAGE WARPAGE MEASUREMENT OF SURFACE-MOUNT INTEGRATED CIRCUITS AT ELEVATED TEMPERATURE
  • standard by JEDEC Solid State Technology Association, 10/01/2009
  • Publisher: JEDEC

$37.00$74.00


The purpose of this test method is to measure the deviation from uniform flatness of an integrated circuit package body for the range of environmental conditions experienced during the surface-mount soldering operation.

Product Details

Published:
10/01/2009
Number of Pages:
30
File Size:
1 file , 1 MB

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