Provide PDF Format
JEDEC JESD22-B113
- BOARD LEVEL CYCLIC BEND TEST METHOD FOR INTERCONNECT RELIABILITY CHARACTERIZATION OF COMPONENTS FOR HANDHELD ELECTRONIC PRODUCTS
- standard by JEDEC Solid State Technology Association, 03/01/2006
- Publisher: JEDEC
$31.00$62.00
The Board Level Cyclic Bend Test Method is intended to evaluate and compare the performance of surface mount electronic components in an accelerated test environment for handheld electronic products applications. The purpose is to standardize the test methodology to provide a reproducible performance assessment of surface mounted components while duplicating the failure modes normally observed during product level test. This is not a component qualification test and is not meant to replace any product level test that may be needed to qualify a specific product and assembly.
Related Products
JEDEC JESD 82-12A
DEFINITION OF THE SSTU32S869 & SSTU32D869 REGISTERED BUFFER WITH PARITY FOR DDR2 RDIMM APPLICATI..
$37.00 $74.00
JEDEC JESD 82-13A
DEFINITION OF THE SSTVN16859 2.5-2.6 V 13-BIT TO 26-BIT SSTL_2 REGISTERED BUFFER FOR PC1600, PC2100,..
$30.00 $59.00