• JEDEC JESD22-B113
Provide PDF Format

Learn More

JEDEC JESD22-B113

  • BOARD LEVEL CYCLIC BEND TEST METHOD FOR INTERCONNECT RELIABILITY CHARACTERIZATION OF COMPONENTS FOR HANDHELD ELECTRONIC PRODUCTS
  • standard by JEDEC Solid State Technology Association, 03/01/2006
  • Publisher: JEDEC

$31.00$62.00


The Board Level Cyclic Bend Test Method is intended to evaluate and compare the performance of surface mount electronic components in an accelerated test environment for handheld electronic products applications. The purpose is to standardize the test methodology to provide a reproducible performance assessment of surface mounted components while duplicating the failure modes normally observed during product level test. This is not a component qualification test and is not meant to replace any product level test that may be needed to qualify a specific product and assembly.

Related Products

JEDEC JESD 23

JEDEC JESD 23

TEST METHODS AND CHARACTER DESIGNATION FOR LIQUID CRYSTAL DEVICES:  ..

$37.00 $74.00

JEDEC JESD72 (R2007)

JEDEC JESD72 (R2007)

TEST METHODS AND ACCEPTANCE PROCEDURES FOR THE EVALUATION OF POLYMERIC MATERIALS..

$34.00 $67.00

JEDEC JEP155A.01

JEDEC JEP155A.01

RECOMMENDED ESD TARGET LEVELS FOR HBM/MM QUALIFICATION..

$46.00 $91.00

JEDEC JESD22-B110B

JEDEC JESD22-B110B

Mechanical Shock - Component and Subassembly..

$27.00 $54.00