Provide PDF Format
JEDEC JESD22-B113
- BOARD LEVEL CYCLIC BEND TEST METHOD FOR INTERCONNECT RELIABILITY CHARACTERIZATION OF COMPONENTS FOR HANDHELD ELECTRONIC PRODUCTS
- standard by JEDEC Solid State Technology Association, 03/01/2006
- Publisher: JEDEC
$31.00$62.00
The Board Level Cyclic Bend Test Method is intended to evaluate and compare the performance of surface mount electronic components in an accelerated test environment for handheld electronic products applications. The purpose is to standardize the test methodology to provide a reproducible performance assessment of surface mounted components while duplicating the failure modes normally observed during product level test. This is not a component qualification test and is not meant to replace any product level test that may be needed to qualify a specific product and assembly.
Related Products
JEDEC JS-001A-2011
ELECTROSTATIC DISCHARGE SENSITIVITY TESTING, HUMAN BODY MODEL (HBM) - COMPONENT LEVEL..
$35.00 $69.00
JEDEC JESD 12-1B
ADDENDUM No. 1 to JESD12 - TERMS AND DEFINITIONS FOR GATE ARRAYS AND CELL-BASED INTEGRATED CIRCUITS..
$30.00 $60.00
JEDEC JESD8-6
ADDENDUM No. 6 to JESD8 - HIGH SPEED TRANSCEIVER LOGIC (HSTL)- A 1.5 V OUTPUT BUFFER SUPPLY VOLTAGE ..
$30.00 $60.00