• Your shopping cart is empty!

  • JEDEC JESD22-B115A.01
Provide PDF Format

Learn More

JEDEC JESD22-B115A.01

  • SOLDER BALL PULL
  • standard by JEDEC Solid State Technology Association, 07/01/2016
  • Publisher: JEDEC

$34.00$67.00


This document describes a test method only; acceptance criteria and qualification requirements are not defined. This test method applies to solder ball pull force/energy testing prior to end-use attachment. Solder balls are pulled individually using mechanical jaws; force, fracture energy and failure mode data are collected and analyzed. Other specialized solder ball pull methods using a heated thermode, gang pulling of multiple solder joints, etc., are outside the scope of this document. Both low and high speed testing are covered by this document. This is a minor editorial revision to JESD22-A115A.

Product Details

Published:
07/01/2016
Number of Pages:
25
File Size:
1 file , 400 KB

Related Products

JEDEC JESD223-1

JEDEC JESD223-1

Universal Flash Storage Host Controller Interface (UFSHCI), Unified Memory Extension..

$30.00 $60.00

JEDEC JESD8-2

JEDEC JESD8-2

ADDENDUM No. 2 to JESD8 - STANDARD FOR OPERATING VOLTAGES AND INTERFACE LEVELS FOR LOW VOLTAGE EMITT..

$26.00 $51.00

JEDEC JEP158

JEDEC JEP158

3D Chip Stack with Through-Silicon Vias (TSVS): Identifying, Evaluating and Understanding Reliabilit..

$31.00 $62.00

JEDEC JEP150

JEDEC JEP150

STRESS-TEST-DRIVEN QUALIFICATION OF AND FAILURE MECHANISMS ASSOCIATED WITH ASSEMBLED SOLID STATE SUR..

$30.00 $60.00