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JEDEC JESD22-B116A
- WIRE BOND SHEAR TEST
- standard by JEDEC Solid State Technology Association, 08/01/2009
- Publisher: JEDEC
$31.00$62.00
This test provides a means for determining the strength of a gold ball bond to a die bonding surface or an aluminum wedge or stitch bond to a die or package bonding surface, and may be performed on pre-encapsulation or post-encapsulation parts. The wire bond shear test is destructive. It is appropriate for use in process development, process control and/or quality assurance.
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