Provide PDF Format
JEDEC JESD22-B116A
- WIRE BOND SHEAR TEST
- standard by JEDEC Solid State Technology Association, 08/01/2009
- Publisher: JEDEC
$31.00$62.00
This test provides a means for determining the strength of a gold ball bond to a die bonding surface or an aluminum wedge or stitch bond to a die or package bonding surface, and may be performed on pre-encapsulation or post-encapsulation parts. The wire bond shear test is destructive. It is appropriate for use in process development, process control and/or quality assurance.
Related Products
JEDEC J-STD-033B.1
JOINT IPC/JEDEC STANDARD FOR HANDLING, PACKING, SHIPPING AND USE OF MOISTURE/REFLOW SENSITIVE SURFAC..
$34.00 $67.00
JEDEC JESD 22-A117B
ELECTRICALLY ERASABLE PROGRAMMABLE ROM (EEPROM) PROGRAM/ERASE ENDURANCE AND DATA RETENTION TEST..
$31.00 $62.00