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  • JEDEC JESD22-B118
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JEDEC JESD22-B118

  • SEMICONDUCTOR WAFER AND DIE BACKSIDE EXTERNAL VISUAL INSPECTION
  • standard by JEDEC Solid State Technology Association, 03/01/2011
  • Publisher: JEDEC

$30.00$59.00


This inspection method is for product semiconductor wafers and dice prior to assembly. This test method defines the requirements to execute a standardized external visual inspection and is a non-invasive and nondestructive examination that can be used for qualification, quality monitoring, and lot acceptance.

Product Details

Published:
03/01/2011
Number of Pages:
18
File Size:
1 file , 770 KB

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