• JEDEC JESD51-7
Provide PDF Format

Learn More

JEDEC JESD51-7

  • HIGH EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD FOR LEADED SURFACE MOUNT PACKAGES
  • standard by JEDEC Solid State Technology Association, 02/01/1999
  • Publisher: JEDEC

$27.00$53.00


This fixturing further defines the environment for thermal test of packaged microelectronic devices. Its function is to provide an alternate mounting surface for the analysis of heat flow in electronic components. The objective of the standard is to provide a high effective thermal conductivity mounting surface that can be compared equally against standard tests done in different laboratories with typical variations of less than or equal to 10%.

Related Products

JEDEC JEP158

JEDEC JEP158

3D Chip Stack with Through-Silicon Vias (TSVS): Identifying, Evaluating and Understanding Reliabilit..

$31.00 $62.00

JEDEC JESD8-19

JEDEC JESD8-19

POD18 - 1.8 V Pseudo Open Drain I/O..

$27.00 $54.00

JEDEC JESD671B

JEDEC JESD671B

Component Quality Problem Analysis and Corrective Action Requirements (Including Administrative Qual..

$30.00 $59.00

JEDEC JESD49A.01

JEDEC JESD49A.01

PROCUREMENT STANDARD FOR KNOWN GOOD DIE (KGD)..

$30.00 $60.00