• Your shopping cart is empty!

  • JEDEC JESD51-9
Provide PDF Format

Learn More

JEDEC JESD51-9

  • TEST BOARDS FOR AREA ARRAY SURFACE MOUNT PACKAGE THERMAL MEASUREMENTS
  • standard by JEDEC Solid State Technology Association, 07/01/2000
  • Publisher: JEDEC

$30.00$60.00


This standard covers the design of printed circuit boards (PCBs) used in the thermal characterization of ball grid array (BGA) and land grid array (LGA) packages. It is intended to be used in conjunction with the JESD51 series of standards that cover the test methods and test environments. JESD51-9 was developed to give a figure-of-merit of thermal performance that allows for accurate comparisons of packages from different suppliers. It can be used to give a first order approximation of system performance and, in conjunction with the other JESD51 PCB standards, allows for comparisons of the various package families.

Product Details

Published:
07/01/2000
Number of Pages:
20
File Size:
1 file , 210 KB

Related Products

JEDEC JESD8-16A

JEDEC JESD8-16A

BUS INTERCONNECT LOGIC (BIC) FOR 1.2 V..

$34.00 $67.00

JEDEC JESD223-1A

JEDEC JESD223-1A

Universal Flash Storage Host Controller Interface (UFSHCI), Unified Memory Extension..

$36.00 $72.00

JEDEC JESD84-C43

JEDEC JESD84-C43

EMBEDDED MULTIMEDIACARD (e*MMC)MECHANICAL STANDARD..

$27.00 $54.00

JEDEC JESD 24-8 (R2002)

JEDEC JESD 24-8 (R2002)

ADDENDUM No. 8 to JESD24 - METHOD FOR REPETITIVE INDUCTIVE LOAD AVALANCHE SWITCHING..

$26.00 $51.00