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  • JEDEC JESD59
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JEDEC JESD59

  • BOND WIRE MODELING STANDARD
  • standard by JEDEC Solid State Technology Association, 06/01/1997
  • Publisher: JEDEC

$28.00$56.00


This standard describes the modeling of a bond wire from an integrated circuit (IC) die to a package lead in a ball or wedge type wire bond configuration.

Product Details

Published:
06/01/1997
Number of Pages:
16
File Size:
1 file , 260 KB

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