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JEDEC JESD59

BOND WIRE MODELING STANDARD
standard by JEDEC Solid State Technology Association, 06/01/1997
Publisher: JEDEC

$28.00$56.00

Description

This standard describes the modeling of a bond wire from an integrated circuit (IC) die to a package lead in a ball or wedge type wire bond configuration.

Product Details

Published:: 06/01/1997
Number of Pages:: 16
File Size:: 1 file , 260 KB

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