• JEDEC JESD92
Provide PDF Format

Learn More

JEDEC JESD92

  • PROCEDURE FOR CHARACTERIZING TIME-DEPENDENT DIELECTRIC BREAKDOWN OF ULTRA-THIN GATE DIELECTRICS
  • standard by JEDEC Solid State Technology Association, 08/01/2003
  • Publisher: JEDEC

$37.00$74.00


This document defines a constant voltage stress test procedure for characterizing time-dependent dielectric breakdown or "wear-out" of thin gate dielectrics used in integrated circuit technologies. The test is designed to obtain voltage and temperature acceleration parameters required to estimate oxide life at use conditions. The test procedure includes sophisticated techniques to detect breakdown in ultra-thin films that typically exhibit large tunneling currents and soft or noisy breakdown characteristics. This document includes an annex that discusses test structure design, methods to determine the oxide electric field in ultra-thin films, statistical models, extrapolation models, and example failure-rate calculations.

Related Products

JEDEC JESD76-2

JEDEC JESD76-2

STANDARD DESCRIPTION OF 1.2 V CMOS LOGIC DEVICES (NORMAL RANGE OPERATION)..

$24.00 $48.00

JEDEC JESD 24

JEDEC JESD 24

POWER MOSFETS..

$46.00 $91.00

JEDEC JESD22-B106D

JEDEC JESD22-B106D

RESISTANCE TO SOLDER SHOCK FOR THROUGH-HOLE MOUNTED DEVICES..

$27.00 $53.00

JEDEC JESD82-17

JEDEC JESD82-17

DEFINITION OF THE SSTUA32S868 AND SSTUA32D868 REGISTERED BUFFER WITH PARITY FOR 2R X 4 DDR2 RDIMM AP..

$37.00 $74.00