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SAE AMS3690C
- Adhesive Compound, Epoxy Room Temperature Curing
- standard by SAE International, 07/01/2009
- Publisher: SAE
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This specification covers a two-component compound, an epoxy resin base and a hardener, in the form of a paste.This adhesive compound has been used typically for non-structural bonding of metallic alloys and thermosetting plastics to themselves and to each other; it is intended primarily as an adhesive for electrical components nd devices operating at not higher than 185 \mDF (85 \mDC), but usage is not limited to such applications.
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