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SME AD910398

Alternatives To Solvent Bonding And How To Design For Them
standard by Society of Manufacturing Engineers, 06/01/1991
Publisher: SME

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Description

THIS PAPER PRESENTS THE NUMEROUS BONDING TECHNOLOGY FOR THERMOPLASTICS. IT ENFORCES HOW CURRENT ADHESIVE TECHNOLOGY CAN REPLACE SOLVENTS. RECOMMENDATIONS ON HOW TO DESIGN JOINTS ARE PRESENTED.

Product Details

Published:: 06/01/1991
Number of Pages:: 12
File Size:: 1 file , 660 KB

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