Provide PDF Format
SME AD97-207
- Finite Element Analysis For Internal Stress Of Room Temperature Cured Adhesives
- standard by Society of Manufacturing Engineers, 11/01/1997
- Publisher: SME
$9.00$18.00
An internal stress (residual stress) of room temperature cured adhesive generated during curing process causes the damage, such as detachment and/or deformation and/or cracking, in the bonded structures. However, a numerical analysis method for the internal stress of room temperature cured adhesive has not been established. In this study, the numerical analysis using the finite element method (FEM) for the internal stress was examined. Good results were obtained in a comparison between calculated and experimental deformation.
Related Products
SME MF00-187
Investigating Process Induced Micro Voids Effect On The Elastic Properties Of Lcm Polymer Composites..
$9.00 $18.00
SME ER98-309
Development Of A Concurrent Engineering Scenario For Educational Purposes..
$9.00 $18.00
SME MR98-182
Tracing The Morphological Changes Of Diamond Abrasives With Lead-Tape Imprints And Sem..
$9.00 $18.00
