SME EE00-137

This paper will review the implementation of a flip chip product in a typical SMT production process. Several modifications in equipment, materials, and processes are required. Flip chip is not just another package on the board. We will review several manufacturing issues and discuss how we solved them for this specific product. Starting with the inspection of incoming parts and boards, the paper will discuss approaches for integration of slip chip in a standard SMT process and address the problem areas associated with implementation. Changes to the typical SMT process and machines will be pointed out using a high density product on rigid flex as an example. Following the process flow for SMT, flip chip related limitations and requirements on each process step will be discussed, focusing on manufacturing related issues.

Product Details

Published:

11/01/2000

Number of Pages:

7

File Size:

1 file , 890 KB