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  • SME EE00-145
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SME EE00-145

  • Optimizing Test Probe Contact For No-Clean Electronic Assemblies
  • standard by Society of Manufacturing Engineers, 11/01/2000
  • Publisher: SME

$9.00$18.00


This paper reviews the PCB and test fixture design criteria, along with key assembly process parameters that affect test probe contact. Through a series of designed experiments, the significance of these factors are investigated. In conclusion, a set of design and process recommendations are presented that provide optimum test probe contact for solder paste vias with a no-clean process.

Product Details

Published:
11/01/2000
Number of Pages:
9
File Size:
1 file , 700 KB

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