SME EE00-161

The research summarized in this paper will help to address some of the issues associated with solder paste reflow assembly of 02\01 components. Attachment pad design, stencil design, component-to-component spacing, component orientation, flux type, and solder paste reflow atmosphere were the major variables researched during the project. The two major responses from the experimentation were assembly yield and assembly quality.

Product Details

Published:

11/01/2000

Number of Pages:

13

File Size:

1 file , 1.2 MB