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SME EE95-263
- Low Stress Aerobic Urethanes Lower Costs For Microelectronic Encapsulation
- standard by Society of Manufacturing Engineers, 06/01/1995
- Publisher: SME
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PIGMENTED, AS WELL AS CLEAR ENCAPSULANTS THAT CURE IN SECONDS SIGNIFICANTLY LOWER MANUFACTURING COSTS BY ELMINATING LONG BAKE CYCLES, OFF-LINE CURING AND EXTRA HANDLING. LOW MODULUS POLYMERS PROVIDE ENCAPSULATION AND UNDERFILL PROTECTION BY MINIMIZING DIFFERENTIAL STRESS ON THE DIFFERENT, YET ADJACENT MATERIALS USED IN CHIP CONSTRUCTION.
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