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SME MF00-174
- Optimal Condition For Embossing Process Of Electron Gun Part
- standard by Society of Manufacturing Engineers, 11/01/2000
- Publisher: SME
$9.00$18.00
In this research, a computer simulation model of embossing process will be generated by using LS-DYNA3D, an explicit, nonlinear dynamic structural FEM analysis code. Next, stress distribution and thickness changes will be analyzed to find the characteristics of the process through case studies of process factors of interest. Then, the effects of the factors and causes of several defects will be identified based on the obtained results. Finally, the design of tool and die, and optimal embossing condition will be recommended.
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