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SME MR00-162
- Effects Of Post-Reflow Cleaning Processes On The Performance Of Flip-Chip Devices
- standard by Society of Manufacturing Engineers, 11/01/2000
- Publisher: SME
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Organic flux residues deposited onto the surfaces of flip-chip assemblies during reflow soldering operations have been shown, in some cases, to affect the properties of underfill materials. The results of a series of experiments designed to evaluate the effects of post-reflux cleaning processes on the performance of flip-chip assemblies are reported.
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