Provide PDF Format
SME MR00-162
- Effects Of Post-Reflow Cleaning Processes On The Performance Of Flip-Chip Devices
- standard by Society of Manufacturing Engineers, 11/01/2000
- Publisher: SME
$9.00$18.00
Organic flux residues deposited onto the surfaces of flip-chip assemblies during reflow soldering operations have been shown, in some cases, to affect the properties of underfill materials. The results of a series of experiments designed to evaluate the effects of post-reflux cleaning processes on the performance of flip-chip assemblies are reported.
Related Products
SME ER96-162
Mult-Disciplinary Modeling Based Geometry--A Base For Manufacturing Engineering Education..
$9.00 $18.00
SME MF98-232
Using Localized Closed-Loop Force Control To Provide Robustness In Sheet Metal Forming..
$9.00 $18.00
