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SME MR900539
- Chip Formation And Material Removal In Grinding Of Ceramics
- standard by Society of Manufacturing Engineers, 06/01/1990
- Publisher: SME
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DEPENDING ON THEIR MICROSTRUCTURE, CERAMICS CAN REACT TO LOCAL LOADING IN DIFFERENT WAYS. IN GRINDING, MACHINING PARAMETERS TOGETHER WITH MATERIAL PROPERTIES OF THE WORK DECIDE ABOUT MICRO-BRITTLE FRACTURE OR PLASTIC DEFORMATION. GRAIN DEPTH OF CUT IS THE MOST IMPORTANT VARIABLE. SURFACE PRODUCED BY BRITTLE REGIME GRINDING CONTAIN DETERMENTAL CRACKS. AS NO FRACTURING IS INVOLVED IN THE GENERATION OF DUCTILE SURFACE STRUCTURES, MECHANICAL DAMAGE CAN BE MINIMIZED. DUCTILE REGIME GRINDING REQUIRES MORE ENERGY THAN BRITTLE REGIME GRINDING. THERMAL DAMAGE TO THE SURFACE LAYER CANNOT BE RULED OUT.
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