SME MR930316

THIS TECHNICAL PAPER COVERS FOUR MAIN AREAS OF PRECISION CLEANING OF ELECTRONIC ASSEMBLIES DURING MANUFACTURE. IT COVERS THE FUTURE OF VAPOR CLEANING OF THESE ASSEMBLIES AND THE CURRENT REGULATORY SITUATION; THE SEMI-AQUEOUS CLEANING ALTERNATIVES; THE POSSIBILITY OF USING HCFC-141B BASED MATERIALS AS A TEMPORARY REPLACEMENT FOR CFCS IN SEVERAL VERY SPECIALIZED AND LIMITED USAGES; AND THE USE OF LESS HEAVILY REGULATED MATERIALS FOR MISCELLANEOUS PRINTED WIRING ASSEMBLY CLEANING OPERATIONS.

Product Details

Published:

06/01/1993

Number of Pages:

26

File Size:

1 file , 1.5 MB